By Anand Asundi
Impending the subject of electronic holography from the sensible standpoint of commercial inspection, electronic Holography for MEMS and Microsystem Metrology describes the method of electronic holography and its growing to be functions for MEMS characterization, residual tension dimension, layout and review, and gadget trying out and inspection. Asundi additionally presents an intensive theoretical grounding that allows the reader to appreciate uncomplicated recommendations and hence determine parts the place this system should be followed. this mixture of either sensible and theoretical strategy will make sure the book's relevance and entice either researchers and engineers willing to guage the possibility of electronic holography for integration into their current machines and methods. Addresses particle characterization the place electronic holography has confirmed potential for dynamic dimension of debris in 3D for sizing and form characterization, with functions in microfluidics in addition to crystallization and aerosol detection studies.Discusses electronic mirrored image holography, electronic transmission holography, electronic in-line holography, and electronic holographic tomography and applications.Covers different functions together with micro-optical and diffractive optical platforms and the checking out of those parts, and bio-imaging.
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Extra info for Digital Holography for MEMS and Microsystem Metrology (Microsystem and Nanotechnology Series? ?(ME20))
The silicon back was etched away by deep reactive ion etching. 1. 18a and b respectively. 18 (a) Digital hologram; (b) Reconstructed amplitude image; (c) Reconstructed phase image; (d) Unwrapped phase image; (e) 3D proﬁle of unwrapped phase; (d) Line proﬁle (Source:  Reproduced by permission of ª 2010 Society of Photo-optical Instrumentation Engineers) amplitude image and used to measure the surface proﬁle of the cantilevers. 18b because of the phase jumps of more than 2p. 18c shows a 3D map of the unwrapped phase image, and the quantitative value of the phase was converted to a length scale.
The back of the silicon was etched away by deep reactive ion etching. The diaphragm is excited by applying an AC driving voltage across the piezoelectric layer. 28. An agilent 4294A precision impedance analyzer (40 Hz–110 MHz) was used to measure the impedance frequency spectrum of the diaphragm. 29. The response of the symmetric modes of the diaphragm shows the change in the impedance value, which represents a phase jump at the resonant frequencies. 29 show the resonant frequencies at the symmetric modes.
Basically the þ1 order from the frequency spectrum of the off-axis hologram is selected, which represents the information about the real image wave. 8 Pre-processing of a digital off-axis hologram 20 Digital Holography for MEMS and Microsystem Metrology inverse Fourier transform of the centered ﬁrst order is called the pre-processed hologram, which is free from zero-order and twin image waves. 3D Proﬁle Measurement Numerically reconstructed phase data is used to measure the 3D proﬁle of the MEMS samples.